Thanks, Ramon. That is exactly why I was confused. It would be a lot of fun to see the customer's face when I showed him the new, improved reliability version of the assembly with all of these capacitors tipped every which way on the long axis. He would probably tell me I have a solderball spattering problem. That would be after he told me what to do with the board. Anybody have a picture of this? Is it really being done? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Wednesday, November 23, 2005 9:14 AM To: [log in to unmask] Subject: Re: [TN] Making existing PWB land areas larger Drink up, Instead of adding a bunch of solder spheres to a BGA ( a part ), two spheres are added to a chip one on each end ( a part ). Probably a template would be necessary to hold the spheres from rolling off the termination prior to reflow temp. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard Sent: Wednesday, November 23, 2005 9:45 AM To: [log in to unmask] Subject: Re: [TN] Making existing PWB land areas larger I think my confusion is because Bogert is speaking of a two-termination tantalum chip capacitor, and are you referring to a multi-termination leadless castellated chip carrier package? I do not understand how Pb90 solder spheres can be attached to each end of a chip capacitor. Or perhaps I just need more coffee..... -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: Wednesday, November 23, 2005 8:08 AM To: [log in to unmask] Subject: Re: [TN] Making existing PWB land areas larger Hi richard, No, this is not an 'Unicum' process, but it is how BGAs were developed. When larger LLCCCs [for those of you too young--leadless ceramic chip carriers] could not be used because of premature SJ failures, we removed the sidewall metallisations at the castellations [thus eliminating the solder fillets] which allowed the LLCCCs to swim up. When this proved to be insufficient for SJ reliability, we used solder balls and cast tin columns [the first BGAs and components with solder (tin) columns--Bell Labs has a couple of patents on this]. You put the solder balls onto the component by a reflow process [same as a BGA--it is the high-temperature hand soldering that is the problem with these components] and you unsolder the components by touching the PCB pad and the high-melt solder ball, not the component. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------