Werner: The TI paper on Page 5 talks about the factor of 50. Their volumetric calculations indicate that you would need 7570 angstroms thickness (30 microinches) to reach 3% in the solder connection, and the max gold thickness for this process is specified at 150A. About ENIG, you're right, there are plenty of people who are unhappy with it, but how many of the complaints are about gold embrittlement? -Joe -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Thursday, November 10, 2005 2:57 PM To: Kane, Joseph E (US SSA); [log in to unmask] Subject: Re: [TN] Gold plated components, what a pain!! Hi Joe, It was the argument you advance: "Now the gold flash on nickel/palladium/gold is only 30 to 150 angstroms thick, which is way below the level where you'd have to worry about gold embrittlement in the bulk solder (like by a factor of 50)" that led to the exemption of ENIG. On the other hand , where to you get the factor of 50 from? It also presumes that yopu are happy with ENIG--not everybody is. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------