Guys and Gals, could anyone define a term "blind build" of MFG lot for reliability test? As my per my limited understanding, the "blind build" mean to be no electrical test performed after the MFG, therefore, the yield data is part of the initial assessment of yield upon recieving at the test facility (doesn't matter if it is in house or external). However, someone point out that "blind build" terminology implys that the test die (chip) is not probed at the waffer supply (un-probed die), that means the initial testing will be 2 yields: the chip yield and assembly yield. Does any of your gurus can tell me what is proper definition of "blind build"? Is there a official definition? Thank you very very much. (I am not try to split hair... please help me to define...). Best regards, jk --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------