Franklin, you are correct, my error. One must planarize when filling buried vias. Gary Franklin Asbell wrote: > That sounds like one strange process??? Are you describing the plating > 'knee'? Why would you need to "planarize" buried vias? Did you mean filled > vias? > > I must be way out of the loop on new processes... > > Franklin > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Ferrari > Sent: Wednesday, November 23, 2005 7:43 AM > To: [log in to unmask] > Subject: Re: [TN] Wrap Around Plating > > Roland, > > Plating wrap is a part of the plating that gets placed in a plated > through hole and "wraps" over the surface conductor. There is concern > that during a planarization process (during the creation of buried vias) > that the surface plating is compromised. Experiments have shown that the > reliability of the plated through hole is compromised when this plating > is removed. > > Regards, > > Gary Ferrari > Ferrari Technical Services > 860-350-9300 > > Roland Jaquet wrote: > >>Very confusing, I know edge plating since 20 years but I don't think it is >>the meaning here, I found .. >> >>see: http://www.precisioneagles.com/PrecisionSurface/wrap_around.htm >> >> >> >>Thank you for your help and replies >> >>Meilleures salutations >>Best Regards >>Rol@nd >> >>www.PCBspecialist.com >> >>-----Original Message----- >>From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker >>Sent: Wednesday, November 23, 2005 4:58 AM >>To: [log in to unmask] >>Subject: Re: [TN] Wrap Around Plating >> >>This is also a very good technique for containing the EMI radiation >>component that is produced by the internal circuitry and escapes through >>the edge of the board provided the edge plating is grounded. >> >>Best regards >> >>Lee >> >>J. Lee Parker, Ph.D. >>JLP Consultants LLC >>804 779 3389 >> ----- Original Message ----- >> From: Franklin Asbell<mailto:[log in to unmask]> >> To: [log in to unmask]<mailto:[log in to unmask]> >> Sent: Tuesday, November 22, 2005 5:55 PM >> Subject: Re: [TN] Wrap Around Plating >> >> >> You may be describing edge plating, I'll explain. >> >> There are times when a connection needs to be made from the top to the >> bottom of a board and the only real estate is the board edge. >> >> The board is processed normally until electroless copper where it is >>routed >> to expose the edge needing the connection. >> >> The board/panel is processed normally through final rout. >> >> At it's completion those areas routed before 1st copper now have an >> electrical connection between the top and bottom. >> >> When viewed from the top/side it can appear as though metal were formed >>or >> wrapped around the edge I suppose. >> >> Franklin >> >> -----Original Message----- >> From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Jaquet >> Sent: Tuesday, November 22, 2005 4:45 PM >> To: [log in to unmask]<mailto:[log in to unmask]> >> Subject: [TN] Wrap Around Plating >> >> Dear Technetters, >> >> I am a bit confused about a terminology - I checked the archives with no >> better understanding. >> >> Wrap Around Plating >> >> The occurrence and usage of those three words are no clear about what is >> understood within the PCB industry .. >> >> Are we talking to protective films / masks / resists >> >> Or plating on surface, sides, of feature? >> >> Or about a packaging including embedded features >> >> Is this an other one we don't use but abuse? >> >> >> >> Thank you for your help >> >> Best Regards >> Rol@nd<mailto:Rol@nd> >> >> www.PCBspecialist.com<http://www.pcbspecialist.com/> >> >> >> Jaquet Roland >> Consultant >> PCBspecialist >> 14 Champ Budin >> 1258 Perly, GENEVA >> Switzerland >> [log in to unmask]<mailto:[log in to unmask]> >> tel: >> fax: >> mobile: >> 41228800405 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