You may be describing edge plating, I'll explain. There are times when a connection needs to be made from the top to the bottom of a board and the only real estate is the board edge. The board is processed normally until electroless copper where it is routed to expose the edge needing the connection. The board/panel is processed normally through final rout. At it's completion those areas routed before 1st copper now have an electrical connection between the top and bottom. When viewed from the top/side it can appear as though metal were formed or wrapped around the edge I suppose. Franklin -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Jaquet Sent: Tuesday, November 22, 2005 4:45 PM To: [log in to unmask] Subject: [TN] Wrap Around Plating Dear Technetters, I am a bit confused about a terminology - I checked the archives with no better understanding. Wrap Around Plating The occurrence and usage of those three words are no clear about what is understood within the PCB industry .. Are we talking to protective films / masks / resists Or plating on surface, sides, of feature? Or about a packaging including embedded features Is this an other one we don't use but abuse? Thank you for your help Best Regards Rol@nd www.PCBspecialist.com Jaquet Roland Consultant PCBspecialist 14 Champ Budin 1258 Perly, GENEVA Switzerland [log in to unmask] tel: fax: mobile: 41228800405 41228800409 41792033723 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------