Hi Joe! I am familiar with what TI has posted on their website but their addition of a Au flash was more than just a cost saving measure. Pd is a very cool element and has some unique properties. Pd is a "getter" material ( it is used in catalytic converters) and can form some interesting organic surface films depending on the use environment - some of the connector vendors have some interesting stories! Using an Au flash "seals" off the Pd surface to the formation of the organic films thus enhancing the component solderability. We have done a bunch of Pd/Ni and Au/Pd/Ni surface finish testing - it is a great finish for both wirebonding and soldering. Now if it wasn't so darn expensive in comparison to the other pwb finishes! Dave "Kane, Joseph E (US SSA)" <joseph.kane@baes To ystems.com> "TechNet E-Mail Forum" <[log in to unmask]>, 11/11/2005 08:13 <[log in to unmask]> AM cc Subject RE: [TN] Gold plated components, what a pain!! Dave: According to TI, they used nickel/palladium until 2001, then switched over to nickel/palladium/gold to save money. Price of palladium had risen substantially, and NiPdAu allowed them to plate thinner palladium. Here's a link: http://www.elecdesign.com/rohs/articles/Selecting%20the%20right%20RoHS%2 0finish.pdf Palladium is a noble metal, so it shouldn't oxidize much, but then again I've seen something that suggests that the gold promotes faster wetting and better spread. Can't find the reference. -Joe -----Original Message----- From: David D. Hillman [mailto:[log in to unmask]] Sent: Friday, November 11, 2005 8:36 AM To: [log in to unmask] Subject: Re: [TN] Gold plated components, what a pain!! HI Ivan! The purpose of the gold is to "protect" the Pd surface from reacting with the environment. Pd is a "getter" material and can form a number of "really neat" surface films, both oxide and/or organic films, depending on the environment. Dave Hillman Rockwell Collins [log in to unmask] Ivanoe Pedruzzi <i.pedruzzi@LABEL GROUP.COM> To Sent by: TechNet [log in to unmask] <[log in to unmask]> cc Subject 11/11/2005 04:36 Re: [TN] Gold plated components, AM what a pain!! Please respond to TechNet E-Mail Forum <[log in to unmask]> ; Please respond to Ivanoe Pedruzzi <i.pedruzzi@LABEL GROUP.COM> But Werner, the 150 A is over Pd, does the Pd have different properties in terms of oxidization, hence, soldering? just for my understanding. THX, Ivan Il giorno 10/nov/05, alle ore 23:16, Werner Engelmaier ha scritto: > I agree that 150 Angstroms of Au "is pretty darn thin"--the problem is > I see most layer thicknesses in the 500 to 1,000 A range. A 150A layer > of au would > not protect the Ni from oxidizing. > > > > Werner > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------