Hi Kevin! There are a number of metallurgical and microstructural reactions that can result in a solder joint not having a "bright and shiny" appearance. The majority of the time the lack of a "bright and shiny" appearance results in absolutely no change in solder joint integrity. The other minority instances, such as too much gold in a solder joint resulting in a grainy appearance, the solder joint integrity is impacted. If you had "bright and shiny" solder joint appearance before then something has changed in your process - the change may not impact the solder joint integrity but you should trace down what is now different. The use of Pbfree solder alloys is going to make the "bright and shiny" solder joint appearance follow the dinosaurs into extinction! JSTD-001 committee removed the "bright and shiny" appearance criteria several years ago. The IPC-HDBK-001 has some good information on "bright and shiny" that may be of use. Dave Hillman Rockwell Collins [log in to unmask] Kevin Glidden <[log in to unmask] COM> To Sent by: TechNet [log in to unmask] <[log in to unmask]> cc Subject 11/08/2005 11:59 [TN] Grainy Solder Joints AM Please respond to [log in to unmask] om We are experiencing dull / grainy TH solder joints, made by hand soldering w/ iron @ 500F. At first, it appeared to be residue on the surface, so I started chasing the cleaner. But all checked out OK. I refluxed (water soluble, ORH0) and reflowed (iron @ 600F). This improved the finished appearance, but not 100%. While eutectic, the joint is perfect. Then when I draw the iron away, it cools and the surface finish is no longer smooth or shiny. What can cause this? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------