> Dear Sir or Madam, > > I would like to ask if there is a standard which specifies the maximum > allowable paste print offset both for lead-rich and lead free processes to > guarantee a correct solder joint after reflow. > > I know three could be quite a number of contributors (variables) which > have direct influence on the quality of the joint after reflow (for a > given maximum print offset) such as the pad finish, flux chemistry and > paste used and pad geometries. However if you know of any standard which > summarises to the worst conditions and gives a maximum allowable print > offset, I would be very grateful if you quote. > > > Regards > > Brian Pulis > Process Engineer > > Dedicated Micros Malta Ltd. > UB2, San Gwann Industrial Estate, > SGN 09. MALTA. > > Tel: (+356)23819 187/199 > > Fax: (+356)23819 100 > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------