Hi Werner, IPC LF Listservers, Werner, I think that most PCB manufacturers expect that a pre-soldering process bake will solve all the problems with embedded moisture and even some chemicals. Hey it solves solder pop voids, blow outs, cracks, , when stuff gets entrapped. To me it seems like you either use the pcb quickly, store it correctly in low moisture, or bake it to stop MSL difficulties. In Lead Free it seems like baking is going to become a standard process for most locations using lower cost laminates with higher soldering temperatures due to components or PCB structure. In addition you have a few tests that tell you if your process has created chemical problems that are imbedded in the laminate structure. So I don't see the need, unless for laminates that are touted as not needing pre-solder baking. Yours in Engineering, Dave YiEngr, MA/NY DDave -------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Leadfree To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL) Search previous postings at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -------------------------------------------------------------------------------