All, To clarify: The brief research I did by now is that the filling shall be with SAN E1 PHP 900. The capping is by copper plating, to generate a fully-matallized pad. Regards Ofer Cohen Manager Quality Assurance, Reliability and Production Technologies Seabridge Ltd. - A Siemens Company Siemens COM FN A SB TQM -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, October 05, 2005 18:17 To: Ofer Cohen; [log in to unmask] Subject: Re: [TN] Filled vias Ofer, You did not say what you filling them with--it makes a difference. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------