Hello, all,
Since the designers (whos vision of the product has a gap starting in the end of the PCB design until they see the assembled board) placed capacitors on the fan-out vias of every 1 mm BGA. No need to say that the vias are through holes, with drill diameter of 0.3 mm (12 mils). This doesn't leave much hope for the soldering. My solution is to fill the vias, then cap them. 

Can somebody suggest DFM for the PCB design, that will ease the PCB manufacturer's task? I mean - the minimum common baseline, so maximum fabricators will be able to deal with it.

Regards

Ofer Cohen
Seabridge - a Siemens company

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