Valerie, Have you published the results of your microvoid investigation? Regards, George George M. Wenger Reliability / FMA Engineer Base Station and Subsystems Group Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Valerie St.Cyr Sent: Wednesday, October 12, 2005 10:45 AM To: [log in to unmask] Subject: Re: [TN] Hasl All, Please see the current issue of Assembly Magazine for an article titled: "Avoiding Microvoids" by Don Cullen; This article is based on a paper presented at the 2005 Electronic Circuits World Conference, which was held Feb. 22-24 in conjunction with APEX and the IPC Printed Circuits Expo. (now that I've given full credit and references ...). Here are some teasers: Initial Investigation Our investigation of microvoids and immersion silver was prompted by the high-visibility failure of a ball grid array (BGA) on a PCB during postassembly power cycling. Microvoids were the culprit. But, what caused the microvoids? The Perfect Storm Our experiments indicated that several factors were necessary to produce microvoids. Intuitively, this seemed correct. Preventing Microvoids "Gerard O'Brien" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 10/12/2005 10:00 AM Please respond to TechNet E-Mail Forum; Please respond to "Gerard O'Brien" To: [log in to unmask] cc: Subject: Re: [TN] Hasl Richard - great come back - perhaps you have missed all the champagne voiding issues with silver! Ask Cisco, et al, the great proponents of Ag what their finish de jour is - it is no longer Ag. All surface finishes come with a price if not applied correctly. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. If you have received it in error, please notify the sender immediately and delete the original. Any unauthorized use of this email is prohibited. ------------------------------------------------------------------------------------------------ [mf2] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------