Some form of wire bonding is done using ultrasonic bonding of gold or aluminum wire( very thin wire ), other way could be using conductive epoxy. Soldering to ENIG over copper finish is done with regular eutectic tin/lead or lead free and flux. My two cents. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Hodge Sent: Tuesday, October 11, 2005 3:39 PM To: [log in to unmask] Subject: Re: [TN] <List>[TN] wire bonding Some would say "prayer". I do not believe that you would use anything except the wedge bonder and the aluminum wire leads. I may be wrong. At 01:42 PM 10/11/2005, you wrote: >Question for the assemblers: > >When wirebonding to ENIG, do you use any solder paste or other "facilitator" > >to create the bond? > >Thanks for your reply... > > > > > > > > > > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To >unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt >or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: >http://listserv.ipc.org/archives Please visit IPC web site >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] >or 847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------