Offer, If you want the vias capped with soldermask than just call out to fill the vias prior to Soldermask. If you want to copper plate over the filled vias than specify that. A good point to specify is how flat or flush with the surface you desire the via fill to be. Also note whether you desire Conductive or Non-Conductive fill. Thanks, James Hofer Director of Operations Accurate Circuit Engineering 3019 S. Kilson Dr. Santa Ana Ca. 92707-4202 714-546-2162 work 714-473-6127 cell [log in to unmask] ----- Original Message ----- From: "Jeffrey Bush" <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, October 05, 2005 10:22 AM Subject: Re: [TN] Filled vias Just state epoxy filling prior to soldermask coat. Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice: 802.257.4571.21 Fax: 802.257.0011 http://www.vtcircuits.com -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ofer Cohen Sent: Wednesday, October 05, 2005 1:07 PM To: [log in to unmask] Subject: [TN] Filled vias Hello, all, Since the designers (whos vision of the product has a gap starting in the end of the PCB design until they see the assembled board) placed capacitors on the fan-out vias of every 1 mm BGA. No need to say that the vias are through holes, with drill diameter of 0.3 mm (12 mils). This doesn't leave much hope for the soldering. My solution is to fill the vias, then cap them. Can somebody suggest DFM for the PCB design, that will ease the PCB manufacturer's task? I mean - the minimum common baseline, so maximum fabricators will be able to deal with it. Regards Ofer Cohen Seabridge - a Siemens company --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------