I would like to get an idea for how and where in the process other fabricators are electrically testing boards with finishes such as tin, silver or OSP which can be easily damaged by test probes/pins. Due to the inherent risks of testing the boards "in-process" prior to the final finish being applied (subsequent damage from handling etc.) I am hesitant to recommend this course of action but most of the chemistry suppliers we have spoken to say that this is what most other shops are doing. Is this true? Microcraft have suggested a number of options for our probe, anything from inexpensive contact pressure adjustments to more costly replacement probe heads. What about fixture (grid) testers? Are people using domed pins, testing in-process or what? As always, any input is much appreciated. Best Regards, John Parsons Enigma Interconnect Inc. - Vancouver --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------