Eddie,
I think that there are books out that indicate the percentage of gold in
solder that will lead to brittle joints. I think the IPC spec says less than
0.2% gold in solder is acceptable. Your customer should be able to calculate
solder volume vs. Gold volume and determine the percentage. If it is below
the 0.2% he should be OK.

Joel Mearig
Delta Tau Data Systems, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Wednesday, October 26, 2005 10:50 AM
To: [log in to unmask]
Subject: [TN] ENIG and brittleness

I have a customer looking to convert over to ENIG but would
like to see information that shows he doesn't need to be
concerned with brittle solder joints. Where could I find
this type of information?

Thank you,
Eddie Rocha
South Bay Circuits

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