Alas, I wish I was consulting again as this would be money in the bank for those using 100% Sn. Brittle brittle brittle, my old Chemical Rubber handbook describes tin as the crying metal due to crystal cracking. Rel testing that I ran on both reflow and thru hole assemblies lead me to abandon Sn100 and Sn99C due to solder joint cracking so lots of luck. John maxwell Wenger, George M. wrote: >Phil, > >Did I miss something on TN? You made the comment that "Sn100C is less >expensive than SAC 305(the IPC alloy of choice)." Has the IPC come out >and indorsed SAC 305 for Pb-Free wave soldering? I know the IPC Solder >Products Value Council has indicated that "the 96.5/3.0/0.5 SAC alloy >be the lead free alloy of choice for the electronics industry" but that >was based on their surface mount assembly and reliability evaluation not >on a wave soldering evaluation. > >Regards, >George >George M. Wenger, Andrew Corporation >Reliability / FMA Engineer >Base Station & Subsystems Group >40 Technology Drive, Warren, NJ 07059 >(908) 546-4531 [log in to unmask] > > > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------