Dear Technetters! We sometimes receive failed boards from the field with failures on BGA's for repair. Supposing there is no problem with the BGA as a component, supposing that the X-ray test (feinfocus tiger) does not reveal any problems in the solder joints (with exception to cracks which are very hard to detect), what procedure would you suggest? We are concerned with the following: Reliability Cost: the assemblies are still our responsability We are considering: Scrap Repair by reflow and electrical test Repair by installing a new component and electrical test- this includes the possibility of visual inspection of the area under the failed component and finding more out about the failure mechanism) Lately we have performed several destructive tests in order to see the nature of the failures which could not be repaired by reflow, and found: through hole cracks or corrosion in plugged holes pad lifting and conductor cracks solder joint cracks All these were not detected by X-ray. Could you suggest the best procedure? Gaby --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------