Hello, When someone equated soldering to that of salt dissoving in water, it threw me for a loop. Now I am wondering if someone willing to explain how an inter-metallic bond is formed when one of the metals (Ni, in the example below) is not in a liquid state? Thank you in advance, David >From: "Barmuta, Mike" <[log in to unmask]> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Barmuta, >Mike" <[log in to unmask]> >To: [log in to unmask] >Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS >Date: Fri, 28 Oct 2005 12:57:03 -0700 > >Richard: Affinity of the solder and base metal to form an intermetallic >reaction. >I hope you're not running your reflow at 2500F! > > Regards > > Mike Barmuta > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard >Sent: Friday, October 28, 2005 11:46 AM >To: [log in to unmask] >Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS > > >Mike, how do you form a solder joint with the nickel if the nickel does >not melt? > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Barmuta, Mike >Sent: Friday, October 28, 2005 10:43 AM >To: [log in to unmask] >Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS > >Hi Susan: No, there is no need to increase the reflow oven to Pb free >temperatures. > >First the flux in his Sn/Pb solderpaste is not desinged to go to those >temps, so the results will probbaly be worse. > >Second it is not nessesry to get the SAC coating on the part up to it's >melting point to create a good solderjoint. Think of soldering to Ni. >You don't have to reach the melting point of the Ni. > >Since you have not provided any information on the reflow times and >temps or type of flux all I can do is give you a general direction. I >would start with an increase in the dwell time above liquidous, 70-80 >secs, and a peak of 220-225 C. > > >Regards > >Michael Barmuta > >Staff Engineer > >Fluke Corp. > >Everett WA > >425-446-6076 > > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla >Sent: Friday, October 28, 2005 8:08 AM >To: [log in to unmask] >Subject: [TN] LEAD FREE PART IN SNPB PROCESS > > >Happy Friday to All >I have a customer who is now being supplied with parts that the >terminations are SnAgCu (95.5/4/0.5) instead of the previous SnPb. > >His process is not lead free and the parts are not always wetting and >forming an adequate joint. > >What are his choices? Can he/should he take his SnPb line to lead free >temps in an attempt to solder these parts - reflow process? > >Thanks for your advice > >Susan Mansilla >Robisan Lab > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To >unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or >(re-start) delivery of Technet send e-mail to [log in to unmask]: SET >Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the >posts: send e-mail to [log in to unmask]: SET Technet Digest Search the >archives of previous posts at: http://listserv.ipc.org/archives Please >visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for >additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 >ext.2815 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To >unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or >(re-start) delivery of Technet send e-mail to [log in to unmask]: SET >Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the >posts: send e-mail to [log in to unmask]: SET Technet Digest Search the >archives of previous posts at: http://listserv.ipc.org/archives Please >visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for >additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- _________________________________________________________________ Consigue aquí las mejores y mas recientes ofertas de trabajo EE.UU. http://latino.msn.com/empleos --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------