Hi Susan: No, there is no need to increase the reflow oven to Pb free temperatures. First the flux in his Sn/Pb solderpaste is not desinged to go to those temps, so the results will probbaly be worse. Second it is not nessesry to get the SAC coating on the part up to it's melting point to create a good solderjoint. Think of soldering to Ni. You don't have to reach the melting point of the Ni. Since you have not provided any information on the reflow times and temps or type of flux all I can do is give you a general direction. I would start with an increase in the dwell time above liquidous, 70-80 secs, and a peak of 220-225 C. Regards Michael Barmuta Staff Engineer Fluke Corp. Everett WA 425-446-6076 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla Sent: Friday, October 28, 2005 8:08 AM To: [log in to unmask] Subject: [TN] LEAD FREE PART IN SNPB PROCESS Happy Friday to All I have a customer who is now being supplied with parts that the terminations are SnAgCu (95.5/4/0.5) instead of the previous SnPb. His process is not lead free and the parts are not always wetting and forming an adequate joint. What are his choices? Can he/should he take his SnPb line to lead free temps in an attempt to solder these parts - reflow process? Thanks for your advice Susan Mansilla Robisan Lab --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------