Hi Werner, So since the CTEs of the matls involved are different, as are the materials used in other elements of the substrate of similar dimensions, would it be correct to say...(1) the adhesion of the Cu to the fill should be high enough to elastically tolerate the CTE mismatch without delam; or, (2) this separation due to 'resin recession' is typical and is not a reliability risk? We and the customer are tending to go with (1). Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: Wednesday, October 19, 2005 6:15 PM To: [log in to unmask] Subject: Re: [TN] Delamination at Thermal Via area? In a message dated 10/19/05 17:23:15, [log in to unmask] writes: > Hi Leo! > > Your pics are up! Go to: > > http://www.stevezeva.homestead.com/files/Delam_in_Via.jpg > http://www.stevezeva.homestead.com/files/Dalam_in_Via_Close.jpg > Hi, What this pics show is a classical case of 'resin recession.' It happens with PTV-barrels all the time; however, the term 'resin recession' is a misnomer. During excursion to soldering T's, the polymeric fill will expand more than the Cu-barrel and push the Cu-caps outward plastically deforming them. On cooling, the resin 'recedes' to its original volume, the plastically deformed Cu cannot follow, and you have this classic case of 'resin recession.' Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------