Good day all, Is there anybody who knows how can I calculate the necessary solder paste volume, which will hold QFPs and BGAs over bottom side of PCB during secondary side reflow process? Thanks, Rosen Arabadzhiev, Process Engineer CENTILLION LTD</br>-----------------------------</br> <a target='_blank' href="http://www.mail.bg/ads/adclick.php?bannerid=2799&zoneid=13&source=&dest=http%3A%2F%2Fwww.zora.bg%2F&ismap="> http://www.zora.bg - online магазин. Бързо, лесно и удобно!</br> Вече можете да пазарувате в МАГАЗИНИ ЗОРА през интернет! </a><div id="beacon_2799" style="position: absolute; left: 0px; top: 0px; visibility: hidden;"><img src='http://www.mail.bg/ads/adlog.php?bannerid=2799&clientid=2047&zoneid=13&source=&block=0&capping=0&cb=3e27c4f6ad9d6dcc0aba5f5795b6a950' width='0' height='0' alt='' style='width: 0px; height: 0px;'></div> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------