My two cents worth would add that plugging one side of the barrel could entrap PWB and/or assembly process contaminants which could attack the barrel at a later date. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Mcmaster, Michael Sent: Tuesday, September 20, 2005 11:36 AM To: [log in to unmask] Subject: Re: [TN] My "Okie" cross-section...an epilog. Steve I don't mean to be argumentative or disagree with the lab that did such a fine job on your boards, but I believe you could consider these boards defective IF they caused you a problem. The button plate used for the filled vias is way too thick. This carried over to the surface and subsequent Planarization did not remove the button on the surface. You can see evidence of the attempted planarization in the cross section of the vias. The "button" comes up out of the whole in a nice smooth arc then appears beveled. If I were to hazard a guess, I'd say the plating area on the filled vias was too high and they were overplated. Given the vias are filled because they are in a solderable pad, most of my customers would send them back because of assembly issues (real or anticipated). -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Monday, September 19, 2005 5:53 PM To: [log in to unmask] Subject: [TN] My "Okie" cross-section...an epilog. Good Evening All! Well, I now know as much about the raised vias on a board for an a assembly that we built as I could hope to know. A very professional and informative cross-section was done on the fab that contained blind vias that were used in SMT pads. The lab report was done by a fellow Technetter and his team that have asked to remain nameless. If you recall, these vias looked like little "anthills" in the pads, and there were many opinions offered as to why these vias looked the way they do, from pre-preg resin flowing up through the vias during lamination, to not planarizing the fab after via fill. I think you will find the report and cross-sections informative and interesting. Go to: http://www.stevezeva.homestead.com/files/Raised_Vias.doc Thank-you "Mr. Nameless" and your team for your excellent work! Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------