Folks, We have a requirement to design a daughterboard that will be soldered to the motherboard in place of BGA devices. This means that BGA balls are required (on the secondary side) of the daughterboard so it can be soldered to the existing BGA pattern(s) on the motherboard, as if it were just another BGA. I've not heard of this being done before so I'm hoping others may be able to provide some insight in regards to feasability and process. Thanks Much! Rick --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------