Mornin' all you Technetters! Just to go over things once again, this board is a 10-layer board that has a .045" thick, solid copper core in the center of it. It's made of IPC 4101/26 laminate (GF), the pre-preg is also IPC 4101/26 (PGF). There's 1/2-ounce copper on layers 1,5,6, and 10, all the rest are to be 1-ounce. The drawing doesn't call out for ANY hole fill. There are 163 blind vias in this board. The drill chart calls out for them to be .015" max. When I first looked at the board, I mistakenly thought that they were just solder bumps that occured from the use of via-in-pad. I've seen these bumps before. and not thought too much about them. When I started worrying, was when I observed open holes and them not being covered with solder. But this time, our customer fed back to us that the PowerPAK SO8 device (I have a drawing on my web page of the device) was showing insufficient solder defects, which to me would occur if the device was being held above the board for some reason...I used a 6-mil stencil to build the boards BTW. We've shipped everything that we built. But I do have one extra bare fab that wasn't built...that's where the picture on my web page came from. I'm going have a cross section done on it...because from the feedback I'm getting from everyone, something isn't right with this fab. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX Franklin Asbell <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 09/13/2005 07:41 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Franklin Asbell <[log in to unmask]> To: [log in to unmask]@SMTP@Exchange cc: (bcc: Stephen R Gregory/LABARGE) Subject: Re: [TN] raised vias... What was the material used for fill? See a couple issues, 1. Excessive fill 2. No planarization Correct via fill usually requires planarization after fill to even the surface, even though it appears that was not performed at all there seems to be an excessive amount of fill from the start. I would also suspect from the appearance the presence of voids in the filled holes. Might be worth investigating. Franklin -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Brooks,Bill Sent: Monday, September 12, 2005 5:54 PM To: [log in to unmask] Subject: [TN] raised vias... Can someone give us a read on what they think cause the raised vias on Steve's website picture? http://www.stevezeva.homestead.com page 2. Bill Brooks - KG6VVP PCB Design Engineer, C.I.D.+, C.I.I. Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 Datron World Communications, Inc. _______________________________________ San Diego Chapter of the IPC Designers Council Communications Officer, Web Manager http://dcchapters.ipc.org/SanDiego/ http://pcbwizards.com -----Original Message----- From: Steve Gregory [mailto:[log in to unmask]] Sent: Monday, September 12, 2005 2:28 PM To: [log in to unmask] Subject: Re: [DC] Raised vias Hi Fred and Everybody! Speaking of "Raised Vias" and "Anthills", I have some anthills on some Boards that we're building here now. The anthills aren't from plugging or anything, but are blind via in pad. I thought that they wouldn't present too much of a problem because I thought that after printing paste and reflow, everything would level out...but that wasn't the case. At locations where I was placing something called a PowerPAK SO8, there was open solder defects at some of the joints because (I think) of the raised vias. You can see the PowerPAK part drawing, and the raised vias that I'm talking about on my web page at: http://www.stevezeva.homestead.com . Go to "Picture Page 2" and look for "PowerPAK SO8 and Raised Vias". I don't have a clue why the vias are raised like that...maybe that's a question for the TechNet. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. 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