Thanks Mike, Really appreciate your help Have a great weekend, Bob ----- Original Message ----- From: "Barmuta, Mike" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 23, 2005 4:31 PM Subject: Re: [TN] bonding material > Hi Bob: Based on your inputs a two part epoxy is exactly NOT what you want. > You'll never get 'em apart! > > You probably won't be able to use a U/V reacted material unless the light > source can actually "see" the adhesive. Without seeing how the bondline and > mating surfaces go together it's hard to say. > > If you need a dispensable one part that can be separated after cure then I > would consider something like Loctite 641 Retaining Compound. It's a medium > strength, room temperature cure, one part, dispensable that allows > disassembly. Again I'm not pushing Loctite, just an example. > > You could also consider a bonding film such as 3M's or possibly a one > silicone part. > > > > Regards > > Mike Barmuta > > Staff Engineer > > Fluke Corp. > > Everett WA > > 425-446-6076 > > > > -----Original Message----- > From: Bob Arciolla [mailto:[log in to unmask]] > Sent: Friday, September 23, 2005 11:52 AM > To: TechNet E-Mail Forum; Barmuta, Mike > Subject: Re: [TN] bonding material > > > Hi Mike, > > Thank you for the input, I am looking to dispense from a EFD dispenser, so > one part preferred. The main reason for bonding is to secure the cover to > the case, but still give the customer access to the unit if necessary. It is > a epoxy cured inverter and the casing is more for RF protection. > > Thanks Bob > ----- Original Message ----- > From: "Barmuta, Mike" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Friday, September 23, 2005 2:28 PM > Subject: Re: [TN] bonding material > > > > Bob: In general I would recommend two part epoxy designed for metal > bonding. > > Loctite/Hysol's E-20NS is an example. There are many others available. > > However you do not provide much detail as to the required cured properties > > and environmental exposure. More information could dictate a different > > adhesive type. > > > > > > Regards > > > > Michael Barmuta > > > > Staff Engineer > > > > Fluke Corp. > > > > Everett WA > > > > 425-446-6076 > > > > -----Original Message----- > > From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Arciolla > > Sent: Friday, September 23, 2005 11:09 AM > > To: [log in to unmask] > > Subject: [TN] bonding material > > > > > > Hi all, > > > > I have a unit that we manufacture that has a aluminum case and cover and > was > > wondering if anyone can recommend a bonding material for this and where to > > get it. > > Thanks in advance, > > Bob Arciolla > > Endicott Research Group > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > > To unsubscribe, send a message to [log in to unmask] with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: http://listserv.ipc.org/archives > > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > > for additional information, or contact Keach Sasamori at [log in to unmask] or > > 847-615-7100 ext.2815 > > ----------------------------------------------------- > > Quality/Safety Manager > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > > To unsubscribe, send a message to [log in to unmask] with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: http://listserv.ipc.org/archives > > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > > ----------------------------------------------------- > > > > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------