What a shame. What product class are you building? For anything less than an inexpensive Class one product, I would reject the board. The copper foil in image "blister 1" has lifted all the way to the via. This has applied unexpected and immeasurable forces to metal at the weakest point of the printed circuit. Perhaps this one in particular will be okay. But, you said this was a large lot of boards. The risk of failure, latent failure, would be too high for me, unless I could easily sort functioning from non-functioning and my customers didn't expect long life or high performance. Even then, I would demand an open discount on the price of the lot based on results of the assembly run. The supplier being responsible for cost of production fall out. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Mumtaz Bora Sent: Thursday, September 15, 2005 9:21 PM To: [log in to unmask] Subject: [TN] Rework for Delaminated PWBs Dear Technetters, We have received a large batch of PWBs that is showing delamination after reflow at peak temp. 230C. Laminate is high Tg - 170C. Supplier is proposing to perform the following rework -- on these boards instead of providing replacement parts. Oven bake at 190C for 2.5 hours followed by second bake at 150C for 2 hours at 6kg/cm2 pressure. Will this guarantee a full cure? I am concerned about latent failures and layers opening up as full cure was not achieved the first time. Any inputs from the forum will be appreciated. I will request Steven Gregory to place the image of delamination on his website. Have a great weekend. Thank-you Mumtaz D/ 252 - SMT Process and Component Quality Bldg. V238E Voice (858)-882-1967 Fax (858)-882-3126 Page (858)-635-1180 Cell: (858) -449-7054 email: [log in to unmask] Kyocera-Wireless Corp. 10300, Campus Point Drive --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- San Diego, Ca 92121,USA --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------