Hi George! I work at a contract manufacturing company, and we see solder paste gerber files provided in a few different ways, or sometimes not at all. I sometimes get them with unique shapes that are different from the pad shape on the board. For example I have seen the BGA openings in the solder paste gerber using squares instead the actually shape of the pad on the board which is a circle. I have seen files provided to us as ODB++ files which some stencil vendors have not yet used, and it will take them a bit to get the necessary software to use the file so that they can produce a stencil. Me, I just like a straight 1-to-1 gerber file of the solder paste layer that mirrors the SMT pads and fiducials exactly. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+----------------------------> | | "Kotecki, George"| | | <george.kotecki@N| | | GC.COM> | | | Sent by: TechNet | | | <[log in to unmask]>| | | | | | | | | 09/29/2005 02:05 | | | PM | | | Please respond to| | | TechNet E-Mail | | | Forum | | | <[log in to unmask]>| | | ; Please respond | | | to "Kotecki, | | | George" | | | <george.kotecki@N| | | GC.COM> | | | | |---------+----------------------------> >--------------------------------------------------------------------------------------------------------------| | | | To: [log in to unmask]@SMTP@Exchange | | cc: (bcc: Stephen R Gregory/LABARGE) | | Subject: [TN] Assembly data requirements | >--------------------------------------------------------------------------------------------------------------| To all: What has been your experience regarding solder mask data supplied to contract assemblers? Do they request or use customer supplied data or do they prefer to generate their own stencils based on volumes? This is just an informal poll. Thanks in advance George Kotecki --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------