Thanks to Steven , Geoff , Guy Dennis Kathy, Richard, Phil , Jana and Scott, for your valuable inputs for the PWB Delamination issue. I have evaluated the reworked boards thru 2 passes of reflow and do see some bubbling. I have also subjected some reworked boards thru temp.humidity testing and see some bubbling. We are conducting X-sections to evaluate this. Lot is rejected and waiting for replacement parts. Thank-you Mumtaz D/ 252 - SMT Process and Component Quality Bldg. V238E Voice (858)-882-1967 Fax (858)-882-3126 Page (858)-635-1180 Cell: (858) -449-7054 email: [log in to unmask] Kyocera-Wireless Corp. 10300, Campus Point Drive San Diego, Ca 92121,USA --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------