I'm just passing the message on... it's Steve's board... Thanks, Bill Brooks -----Original Message----- From: Wenger, George M. [mailto:[log in to unmask]] Sent: Monday, September 12, 2005 3:13 PM To: TechNet E-Mail Forum; Brooks,Bill Subject: RE: [TN] raised vias... Bill, It would be much easier to give you an informed answer if you could provide a cross section of the via. Right now any answer would simply be a guess. Are they blind vias? Are they filled through vias? Is the photograph of an "as-received" PCB or is it after reflow? If after reflow was it a standard reflow or Pb-Free reflow? Are the boards FR4, Getek, Teflon? How thick? How many layer?, etc. Regards, George George M. Wenger, Andrew Corporation Reliability / FMA Engineer Base Station & Subsystems Group 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Brooks,Bill Sent: Monday, September 12, 2005 5:54 PM To: [log in to unmask] Subject: [TN] raised vias... Can someone give us a read on what they think cause the raised vias on Steve's website picture? http://www.stevezeva.homestead.com page 2. Bill Brooks - KG6VVP PCB Design Engineer, C.I.D.+, C.I.I. Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 Datron World Communications, Inc. _______________________________________ San Diego Chapter of the IPC Designers Council Communications Officer, Web Manager http://dcchapters.ipc.org/SanDiego/ http://pcbwizards.com -----Original Message----- From: Steve Gregory [mailto:[log in to unmask]] Sent: Monday, September 12, 2005 2:28 PM To: [log in to unmask] Subject: Re: [DC] Raised vias Hi Fred and Everybody! Speaking of "Raised Vias" and "Anthills", I have some anthills on some Boards that we're building here now. The anthills aren't from plugging or anything, but are blind via in pad. I thought that they wouldn't present too much of a problem because I thought that after printing paste and reflow, everything would level out...but that wasn't the case. At locations where I was placing something called a PowerPAK SO8, there was open solder defects at some of the joints because (I think) of the raised vias. You can see the PowerPAK part drawing, and the raised vias that I'm talking about on my web page at: http://www.stevezeva.homestead.com . Go to "Picture Page 2" and look for "PowerPAK SO8 and Raised Vias". I don't have a clue why the vias are raised like that...maybe that's a question for the TechNet. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ---------------------------------------------------------------------------- -------------------- This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. If you have received it in error, please notify the sender immediately and delete the original. Any unauthorized use of this email is prohibited. ---------------------------------------------------------------------------- -------------------- [mf2] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------