Since the demise of 1,1,3-based cleaning systems and a general move to no-clean processing, I believe that there are few (if any) temporary masks still commercially available which are removable with defluxing solvents... unless you include water as a solvent (which it is, of course!). This process if often done with water soluble temporary masking materials, of which there are a number available. Regards, Peter -- -------------------------------------------------------- Peter Swanson [log in to unmask] INTERTRONICS http://www.intertronics.co.uk Tel: +44 1865 842842 Oxfordshire, England INTERTRONICS is dedicated to providing quality material, consumable and equipment solutions to the high technology, high performance assembly industries, incorporating outstanding levels of technical support and customer service. Read our blog! http://www.intertronics.co.uk/blog/blog.htm -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask] Sent: 08 August 2005 18:24 To: [log in to unmask] Subject: Re: [TN] Cleaning of gold wirebond pads Gold pads/fingers can be easily protected & cleaned by applying a solvent soluble maskant to the parts, then removing when ready with a suitable solvent. See NEPCON West Proceedings, 1981- the details are in a paper by G. J. Engelland. Bill Kenyon Global Centre Consulting 3336 Birmingham Drive Fort Collins, CO 80526 Tel: 970.207.9586 Cell: 970.980.6373 email: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------