Hi all, By the way, I am looking after storage cabinete with shelves, overpressured nitrogen as alternative for vacuum storage for moisture sensitive polyimide innerlayers. Any ideas ??? Edward > -----Original Message----- > From: Stadem, Richard [SMTP:[log in to unmask]] > Sent: в аевеси 30 2005 15:05 > To: [log in to unmask] > Subject: Re: [TN] ENIG/ Immersion Gold Plating and Pre-baking & > Solderability > > Baking of ENIG plated boards may be a requirement in order to drive out > moisture even though it can exacerbate a nickel oxide formation that is > already started. But there are other options for moisture removal, > including lower bake temperatures at longer times. You could even lease > a precision scale and see at what length of time is required for simply > putting the PWB into a drybox (a dessicator box such as McDry, not a > nitrogen box) and allowing it to dry at room temperature for a period > long enough to reduce the moisture content by 90% or more. J-STD-030 > does state that the bake times and temperatures they list for components > and pwbs are guidelines. If you can prove your bake process or > dessication process is removing the moisture, then you are qualifying a > lower temp and longer time. You will need to use a number of pwbs in > order to do this, as there is some variation in weights caused by resin > content, etc. But you should be able to show a reduction in the average > of weights (mean weight). > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer > Sent: Friday, August 26, 2005 10:10 AM > To: [log in to unmask] > Subject: [TN] ENIG/ Immersion Gold Plating and Pre-baking & > Solderability > > Hello Everyone, > > Feels great today because IT'S Friday - so all is good! > > Questions: > > Does baking these types of plating affect solderability? If so what > factors play a part (i.e. baking temperature, plating thickness, baking > time, etc...). I know that if baked it can cause the Nickel Oxide layer > to become less solderable if the plating process is Poor (thanks Richard > S.). Is there is a factual study that proves that baking any type of > gold plated boards in any way shape or form reduces the solderability > and/ or reliablity of the joints/ product? I am trying to gather data to > prove to management that baking is a bad decision with this type of > plating and should never be performed. Also if a Gold Plated board of > any type is suspect for high level moisture content - how do you remove > the moisture "IF" baking is not acceptable? > > As always I appreciate your help. If anyone has specific examples or > studies to prove or dis-prove this I would appreciate copies if > available. > > Chris Schaefer > Suntron Corporation > Process Engineer > 540 N. Rogers Road > Olathe, Kansas 66062 > 913.393.5878 > [log in to unmask] > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or > (re-start) delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the > posts: send e-mail to [log in to unmask]: SET Technet Digest Search the > archives of previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------