Bob, what is this best practice process control? We are a user of ENIG, very few issues, but maybe we could go down to no issue. Thanks, Ioan > -----Original Message----- > From: TechNet [SMTP:[log in to unmask]] On Behalf Of Bob Metcalf > Sent: Monday, August 15, 2005 1:47 PM > To: [log in to unmask] > Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations. > > As the former Global Final Finishes Business Manager for Rohm&Haas (formerly > Shipley), I can tell you process control is everything using ENIG. I was > responsible for ENIG, as well as other finishes. I was also around during > the time when there was litigation involving ENIG field failures. We > established a program insisting our customers employ "best practice" process > control or we would not sell them the product. We went from several failures > every month to almost zero. After insuring our customers process was in > control and then setting up a program that insured it stayed that way. > > There are several choices for final finishes and ENIG has it's place and I > believe will continue to. Is it the best finish for all > applications......no. As you can see from the responses, there are many fans > of silver and silver and I believe it is a great finish for many > applications. > > Bob Metcalf > Circuit Solutions > 949-709-2544 > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Hodge > Sent: Thursday, August 11, 2005 11:37 AM > To: [log in to unmask] > Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface > recommendations. > > > Yes Richard, you are right on with the process control part. Every process > has to be controlled. The BGA and blackpad thing. I do not understand the > correllation. I have many thousands of heavily populated BGA designs out > there in serviceland--no black pad problem--ever --in house or at the > customer. It is not just luck either. LOL > > > At 12:22 PM 08/11/2005, you wrote: > >Steve and John, > >I think it is safe to say that ENIG is a good finish, but it > >depends......(sorry, Doug). > >It depends on the fab house or plater, how well they control the plating > >process to prevent the issues. It also depends on the type of assembly > >and its use. However, it is such a difficult process to control that it > >is hard to say when the issues will appear. But eventually they probably > >will, for any user, from any vendor. It is still very much a viable > >option for those who are afraid of potential problems with immersion > >silver or any other surface finish. > >But on the other hand I myself hesitate to re-qualify something if it > >isn't broken. If you have an assembly with ENIG, and you get it from a > >board vendor who seems to be able to do it consistently without > >problems, it would certainly not be wise to change. > >I just know that I would not recommend ENIG for an assembly populated > >with BGA's. Especially if the assembly is going to see a service life > >exposed to high thermal cycling. This is where the dreaded Black Pad > >problem seems to thrive. > >I know that the aerospace industry has not accepted immersion silver, > >but it is only a matter of time. > > > >-----Original Message----- > >From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Hodge > >Sent: Thursday, August 11, 2005 12:44 PM > >To: [log in to unmask] > >Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations. > > > >John, come on now. Anything can happen at any time. I have seen some > >reservations from the IS users as to silver migration possibilities and > >shelf life/handling issues --you might say they have not seen them > >--"yet". > >I have had more problems with HASL, OSP and IT than I have with ENIG. > >ENIG has longer data history than IS, so both shoes have already dropped > >so to speak. Three years without problems, is an eternity in this> > >business, especially when we are expected to build custom products in > >24 hours. > > > > > >At 11:00 AM 08/11/2005, you wrote: > > >with it............YET.......... > > > > > >------------------------------------ > > >Avanex > > >John Burke > > >Senior Manager RoHS Compliance > > >[log in to unmask] > > >40919 Encyclopedia Circle > > >Fremont > > >CA 94538 > > >tel: 510 897 4250 > > >fax: 510 979 0189 > > >mobile: 510 676 6312 > > >------------------------------------ > > > > > > > > >-----Original Message----- > > >From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis > > >Sent: Thursday, August 11, 2005 4:48 AM > > >To: [log in to unmask] > > >Subject: Re: [TN] RoHs board surface recommendations. > > > > > > > > >We have been using ENIG now for about three years and have had no bad > > >experiences with it. NASA for one does not allow the use of silver . > > > > > >-----Original Message----- > > >From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier > > >Sent: Wednesday, August 10, 2005 4:57 PM > > >To: [log in to unmask] > > >Subject: Re: [TN] RoHs board surface recommendations. > > > > > >Hi Steve, > > >I do not know about "bad-mouth ENIG"--I am a reliability consultant, > > >and have had plenty of calls because of ENIG related failures, but not > > >a one about iAg. On the other hand, I do not know about their > > >respective environmental implications. > > > > > >Regards, > > >Werner Engelmaier > > >Engelmaier Associates, L.C. > > >Electronic Packaging, Interconnection and Reliability Consulting > > >7 Jasmine Run > > >Ormond Beach, FL 32174 USA > > >Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904 > > >E-mail: [log in to unmask], Website: www.engelmaier.com > > > > > > > > >--------------------------------------------------- > > >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To > > >unsubscribe, send a message to [log in to unmask] with following text in > > >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt > > >or (re-start) delivery of Technet send e-mail to > > >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing > > >per day of all the posts: send e-mail to > > >[log in to unmask]: SET Technet Digest > > >Search the archives of previous posts at: > > 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