Hello everybody. At present, we are facing to one problem as below: BGA component is shifted after go through reflow machine. We have checked 100% mounting condition at BGA location before reflow, we sure the BGA is not shifed but after reflow the shifted part defect still happened. although we lost much time to investigate but the problem is still not be overcome. The detail of BGA is as below: - BGA size: 15 x 15 - Pitch: 1 mm - Ball dia.: 0.49 mm - Product: RoHS PCBA Anyone who have this experience? Thanks --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------