Don't think so. The oven recipe produces a nice time temperature profile, and we have experimented with removing the gold. The results are near target solder filets. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Dehoyos, Ramon Sent: Friday, August 19, 2005 1:28 PM To: [log in to unmask] Subject: Re: [TN] max thickness electroplated gold Hi Guy: It could also be that the profile is burning off most of the flux, the RSS profile maybe, the result is dull and grainy. A ramp to spike profile or something in between as it is done by some, forget the name of that profile, may be the solution. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey Sent: Thursday, August 18, 2005 4:38 PM To: [log in to unmask] Subject: [TN] max thickness electroplated gold Many of our customers are using the old MIL-STD-275 to specify gold thickness for Hard Gold. They are ordering this because they are doing both wafer and package testing at the die and device level. So, we are seeing 50 to 100 uin of gold over nickel. It hasn't been much of an issue because we build most of the boards by hand soldering methods. We are starting to see components in the parts list for these assemblies that cannot be installed with hand soldering methods. When we solder with printed paste and reflow methods we see dull, grainy joint that are clearly contaminated with gold. When we hand solder this condition is not evident. (I believe the condition may actually be worse because the dissolved gold is more concentrated near the bottom of the fillet. But, that is another discussion). Does any one have a rule of thumb for the maximum thickness of electroplated gold on land patterns intended to receive SMT components . . . say, 0402 passives or MLFs? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------