Hello all, I have not used this forum for a few years so I hope I'm doing this right. I have a question re calculation of defect percentages for PCB Assemblies. The old MIL-STD-2000 standard defined a "defect rate" as the number of observed defects divided by the "normalizing number". The standard requires calculation of the following: (1) an Assembly Defect Rate, which is the assembly defects divided by the normalizing number, where Normalizing Number is (total no. of components, component leads, terminals and wires on the assembly plus one for the PWB); and (2) a Solder Defect Rate, which is the solder defects divided by the normalizing number, where Normalizing Number is (total no. of terminals plus total no. of solder connections). I cannot find any guideline in J-STD-001 or IPC-A-610 for calculating defect rates. I am trying to find some non-time- consuming method for calculating the Normalizing Numbers. For example, would the Solder Normalizing Number just be the total no. of component leads? I would appreciate some guidance. Thanks in advance. Paul Baine Q.A. Manager C-Tech Ltd. Cornwall, Ontario, Canada --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------