As others have said wet lamination has been around for years and Dupont is currently promoting the process. The process is relatively simple - before the core reaches the rollers and resist the core is run across a wet roller. Early on Dupont used what they termed a sock - essentially a cotton material soaked in water. I believe they have improved on this model. For test purposes you can manually wet the panel in the same manner. Dampen a sponge or cloth and coat each side of the panel with water. (Use D.I. water) Immediatley after wetting the panel feed it into the hot roll laminator. When I say wet the panel what I mean is to dampen the panel. It should not be dripping wet. This is a rather crude method but will work. Good Luck Pete >From: Baski Devre <[log in to unmask]> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Baski Devre ><[log in to unmask]> >To: [log in to unmask] >Subject: [TN] Wet Lamination >Date: Mon, 29 Aug 2005 17:08:57 +0300 > >Dear Technetters > >I read an articel on wet lamination so below is the quatation from the >article > "Wet lamination of dry film photoresist is not new, but is >growingd >significantly in popularity as cost and technology demands are increasing. >Wet lamination helps reduce defects attributed to poor dry film >conformation. Key to success for wet lamination has been the reliabilty of >the equipment, the wetting station that is attached to the dry film >laminator. There are currently about 120 installed wet lamination units in >operation which confirms that this process is dependable. the wet >lamination >process has demonstrated significantly improved yields through a reduction >in condutor opens/nicks." > I have elaborated on the article "dry Film Photoresist Technology >for >Profitable Western PCB Production" >First of all thank you for that you issued such a half technical and half >economical article. We are PCB manufacturer and we apply dry film panel >palting and as you mentioned in your article wet lamination will avoid some >nicks and opens defects. So How we can apply these wet lamination to our >process. What we need to do what do you advice us to do. Can you please >provide us with technical assistance for this. > >We are waiting for your kind interpretation and knowledge >So is there anybody who has knowledge about wet lamination process and what >kind of equipments we need to convert our process to wet lamination >process.? >Best Regards > > > > >Yusuf GÖMEÇ >Product Quality Engineer > >BASKI DEVRE SAN ve TIC LTD STI >Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey > >Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention) > 00 90 216 4836560 (4 Hat/Line)-173(Extention) >Fax: 00 90 216 3544941 > 00 90 216 4913269 >Gsm: 00 90 533 6579897 > 00 90 533 7480014 > >Internet: www.baskidevre.com.tr > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------