Hello Everyone, Feels great today because IT'S Friday - so all is good! Questions: Does baking these types of plating affect solderability? If so what factors play a part (i.e. baking temperature, plating thickness, baking time, etc...). I know that if baked it can cause the Nickel Oxide layer to become less solderable if the plating process is Poor (thanks Richard S.). Is there is a factual study that proves that baking any type of gold plated boards in any way shape or form reduces the solderability and/ or reliablity of the joints/ product? I am trying to gather data to prove to management that baking is a bad decision with this type of plating and should never be performed. Also if a Gold Plated board of any type is suspect for high level moisture content - how do you remove the moisture "IF" baking is not acceptable? As always I appreciate your help. If anyone has specific examples or studies to prove or dis-prove this I would appreciate copies if available. Chris Schaefer Suntron Corporation Process Engineer 540 N. Rogers Road Olathe, Kansas 66062 913.393.5878 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------