hi guys and girls, i have a solid gold board , the tracks are soild plated gold about 25 microns thick , no ni, over 2 microns of copper (outer space reasons) and i was wondering how to solder the components , would the soild gold traces cause brittle joints, or would the large gold ratio allow a good soilder joint with lead free solder or any type of solder. I have no experiance with soild gold at all and was hoping some one out there would has a guess. PS the traces are only 10 microns wide in areas which is an other problem robert Tarzwell director of technology Sierra Proto express. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------