Peer, Internal short, hmm? Start with high magnification x-ray. If you were talking about opens, I would also suggest acoustic microscopy. This is really a question for the EDFAS bulletin board - equivalent of TechNet (EDFAS is an arm of ASM - which used to be called American Society of Metals, I think, but the meaning has disappeared, just like it has for IBM and IPC). If you are going to send it to the supplier I would suggest: 1) Sending the whole board, if you have no intellectual property concerns 2) Cutting the part out of the board still attached to the laminate it is soldered to 3) Only desolder the part if you know it is dry because you have dried it as per J-033 AND are sure that the heat of desoldering will not mess with what you want the supplier to look at. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Lee Sent: July 19, 2005 1:58 AM To: [log in to unmask] Subject: [TN] Component Failure analysis Technet, What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after soldering. Troubleshooting has pointed towards that failure is component (not soldering process) related. I am looking for an independent lab that can offer such service. Rgds, Peter --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------