Doug, Sometimes my all encompassing statements do not give enough of the nitty gritty details. Too often when I start with the details I can see my listener's eyes roll into the back of their head. OK. Would it help if I said it has fewer issues? From our research with Immersion Silver we need to keep the boards sealed until use them and then handle with rubber gloves. Immersion Tin is a little more forgiving on storage and can be handled with cotton gloves. ENIG seems to be less affected by storage and handling. If I'm WAY off base, I apologize and retreat in disarray. Phil -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls Sent: Thursday, July 28, 2005 9:12 AM To: [log in to unmask] Subject: Re: [TN] RoHs board surface recommendations. Whoa. Back up the trolley. All boards have handling and storage issues. Maybe not from a solderability perspective but certainly from a cleanliness perspective. Never make all encompassing statements, which, come to think of it, is an all encompassing statement........ Doug Pauls Phil Nutting <PNutting@KAISERS YSTEMS.COM> To Sent by: TechNet [log in to unmask] <[log in to unmask]> cc Subject 07/28/2005 08:03 Re: [TN] RoHs board surface AM recommendations. Please respond to TechNet E-Mail Forum <[log in to unmask]> ; Please respond to Phil Nutting <PNutting@KAISERS YSTEMS.COM> And ENIG has no handling and storage issues like Immersion Silver and Immersion Tin. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis Sent: Thursday, July 28, 2005 8:49 AM To: [log in to unmask] Subject: Re: [TN] RoHs board surface recommendations. If you are talking about PWB metallization, I would recommend ENIG. It is compatible with both Tin/Lead and Lead-free. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos Sent: Thursday, July 28, 2005 8:27 AM To: [log in to unmask] Subject: [TN] RoHs board surface recommendations. Good Day TecNetters. Does anybody out there have Board surface recommendations for a RoHs process ? A matrix would be preferred. I don't seem to recall seeing any such type of document or discussions on TechNet so any help would be greatly appreciated. Barry Western Electronics. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------