Check with the vendor concerning sensitivity to thermal shock. It has been a severe problem in the industry for many years. Most recommend a preheat to within 50 degrees of reflow temp.prior to reflow. This can ruin your day if you are hand soldering. -----Original Message----- From: Dale Ritzen [mailto:[log in to unmask]] Sent: Thursday, July 14, 2005 3:01 PM To: [log in to unmask] Subject: Re: [TN] Cracked Passives Karen, Stress is a major factor. We had a devil of a time on one of our customer's boards with chip cap placement too close to the depanelization cut, and also with the positioning of the part, i.e. parallel vs. perpendicular to the edge. One of the chip cap manufacturers (Venkel, SMEC, ???) had a very good white paper on this exact situation a while back, with pictures of how the stress affected the devices in different positions. I no longer have a soft copy of that paper or I'd forward it to you. Perhaps someone else has one (or a similar paper) and can send it your way. Good luck! Dale Ritzen, CQA Quality Manager Austin Manufacturing Services -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Karen Walters Ebner Sent: Thursday, July 14, 2005 1:31 PM To: [log in to unmask] Subject: [TN] Cracked Passives Would anyone list for me in most probable order the causes for cracked capacitors. Has anyone had issues with cracked caps with SnAg Solder paste???? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------