The parts are now all dry and wrinkly. -Chris Stephen Gregory <[log in to unmask] To: [log in to unmask] OM> cc: Sent by: TechNet Subject: [TN] Can somebody decipher <[log in to unmask]> this for me? 07/12/2005 08:49 AM Please respond to TechNet E-Mail Forum; Please respond to Stephen.Gregory Mornin' All! Yesterday, I created two case numbers for technical support at Cypress Semiconductor. One to find out whether or not the ceramic (or aluminum oxide) part I had was moisture sensitive (I haven't heard back from them yet), and the other was to verify what the gold plating thickness is on the leads of the part since it wasn't on the data sheet. Below is the text pasted from the email exchange that we had: Case number: 2LSUG88 Created at: 07/11/2005 Part Number:5962-9759802QXC Product: Programmable Logic > Programmable Logic Devices Subject: Gold Plating Thickness on Leads... Description: I would like to find out what the gold plating thickness is on the leads for the part number above. J-STD-001 requires that the gold must be removed by a double-dip tinning process, or by a single dip in a dynamic solder bath if the plating is above a certain thickness. I need this information to determine whether or not I have to remove the gold prior to board assembly. Hi Stephen, Requested part number 5962-9759802QXC is pruned part. Date of pruning is 05-may-2005. Please advise if you still need the information although this part is pruned. Best Regards, Rose Sandoval Quality Systems & Customer Support Cypress Manufacturing Limited, Philippines Can somebody tell me what they're trying to say? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------