I have no data on pressing into ENIG plated Backpanes, but I have about 7 years doing it on .250" thk ENIG backplanes pressing Teradyne VHDM compliant connectors (roughly 6,000 IO per backplane) and I have had no issue. The biggest thing is to make sure your backplane house can achieve the +.002/-.002 tolerance. Dave Seymour <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 07/28/2005 09:47 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Dave Seymour <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] RoHs board surface recommendations. Ofer, The statement "that bans the ENIG from use when Press-Fit connectors are installed." is interesting. Do you have articles or data that show support this statement? Thanks,. Dave Ofer Cohen wrote: >Phil, >Rubber glove and immersion Silver? > >Apropos the encompassing statement - not to mention the good ol' black >pads (that still show their face here and there, in spite of the better >chemistry), there is the Ni brittleness, that bans the ENIG from use >when Press-Fit connectors are installed. > >Regards >Ofer Cohen >Manager >Quality Assurance, Reliability and Production Technologies >Seabridge Ltd. - A Siemens Company >Siemens COM FN A SB TQM > > > >>-----Original Message----- >>From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting >>Sent: Thursday, July 28, 2005 3:24 PM >>To: [log in to unmask] >>Subject: Re: [TN] RoHs board surface recommendations. >> >>Doug, >> >>Sometimes my all encompassing statements do not give enough of the >> >> >nitty > > >>gritty details. Too often when I start with the details I can see my >>listener's eyes roll into the back of their head. >> >>OK. Would it help if I said it has fewer issues? From our research >>with Immersion Silver we need to keep the boards sealed until use them >>and then handle with rubber gloves. Immersion Tin is a little more >>forgiving on storage and can be handled with cotton gloves. ENIG >> >> >seems > > >>to be less affected by storage and handling. >> >>If I'm WAY off base, I apologize and retreat in disarray. >> >>Phil >> >>-----Original Message----- >>From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls >>Sent: Thursday, July 28, 2005 9:12 AM >>To: [log in to unmask] >>Subject: Re: [TN] RoHs board surface recommendations. >> >>Whoa. Back up the trolley. All boards have handling and storage >>issues. >>Maybe not from a solderability perspective but certainly from a >>cleanliness >>perspective. >> >>Never make all encompassing statements, which, come to think of it, is >>an >>all encompassing statement........ >> >>Doug Pauls >> >> >> >> >> Phil Nutting >> <PNutting@KAISERS >> YSTEMS.COM> >>To >> Sent by: TechNet [log in to unmask] >> <[log in to unmask]> >>cc >> >> >>Subject >> 07/28/2005 08:03 Re: [TN] RoHs board surface >> AM recommendations. >> >> >> Please respond to >> TechNet E-Mail >> Forum >> <[log in to unmask]> >> ; Please respond >> to >> Phil Nutting >> <PNutting@KAISERS >> YSTEMS.COM> >> >> >> >> >> >> >>And ENIG has no handling and storage issues like Immersion Silver and >>Immersion Tin. >> >>-----Original Message----- >>From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis >>Sent: Thursday, July 28, 2005 8:49 AM >>To: [log in to unmask] >>Subject: Re: [TN] RoHs board surface recommendations. >> >>If you are talking about PWB metallization, I would recommend ENIG. It >>is >>compatible with both Tin/Lead and Lead-free. >> >>-----Original Message----- >>From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos >>Sent: Thursday, July 28, 2005 8:27 AM >>To: [log in to unmask] >>Subject: [TN] RoHs board surface recommendations. >> >>Good Day TecNetters. >> >>Does anybody out there have Board surface recommendations for a RoHs >>process >>? >> >>A matrix would be preferred. I don't seem to recall seeing any such >> >> >type > > >>of >>document >>or discussions on TechNet so any help would be greatly appreciated. >> >>Barry >>Western Electronics. >> >> >> >> >>--------------------------------------------------- >> >> -- Dave Seymour, CID+ Catapult Communications Inc. 800 Perimeter Park Dr, Suite A Morrisville, NC 27560 Direct: (919)653-4249 Main: (919)653-4180 Fax: (919)653-4297 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------