Thanks Steve, a guidance: the pics show (increasing magnification)ENIG gold with varying bondability. Heavy wire Al wedge U/S worked, but fine wire ball bonding did not. The reason was that small areas had a gold with insufficient adhesion to the underlying nickel, resulting in bond lifts whatever machine parameters we used. With a naked eye, the boards looked quite normal, ligth microscopy did not disguise the cause either. As I said, Roger Massey helped me that time. Has he left TN? Ingemar Hernefjord Ericsson Microwave Systems -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen Gregory Sent: den 3 juni 2005 20:52 To: [log in to unmask] Subject: Re: [TN] Residue on bondable gold? Hi All! Was a little tardy getting these pictures up, but this morning Inge sent me some really nice SEM images of residues on bondable gold. Go to: http://www.stevezeva.homestead.com Look at; "Gold Residues, Gold Residues 2,3, and 4". Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------