Hi Technet, It's been some time since my last post to this forum, unfortunately I was to busy to follow the discussions or contribute to them! But now I need some advice: The ANSI/JSTD 001 clearly states that inspection for cleanliness should be done without any magnification.In the IPC-A-610 this remark about not using magnification is missing, therefore it is thought by one of our customers that whenever you see a residue with the magnification that's used for inspecting the solder joint (i.e. 10 times), it must be reworked if the residue is present on the solderjoint. To my knowledge it is not intended for the IPC-A-610 to be much more critical than the J-STD-001, and I believe this is not the correct way to inspect. How do you think about this? Best regards, Daan Terstegge --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------