You seem to bother a lot. Our requirement is repair capability at least 5 times. Are you talking ordinary copper lands or PTH connectors? Seems as you mean SMT lands. If you got normal PWBs you should have no problems,considered you follow normal solder temperature and heat exposure procedures. FR4 boards are very, very tough. I've never seen lamination, but I've surely seen lifted traces after repair trials on cheap boards from the far East (toys, watches, kitchen equipments etc) On the other hand, such boards are not done for repair. So, all is dependent on your boards quality level...and your operator's skill. Why not hang a pic on Steve's wall? Ingemar Hernefjord Ericsson Microwave Systems -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of David Harman Sent: den 2 juni 2005 02:36 To: [log in to unmask] Subject: [TN] Rework considerations. Hello, this group has helped me in the past and I am looking forward to hearing others comments on this question on rework. I have an 8 layer board that is approx. 3.5 x 1.25 inches. On the board I have several components; however the one that I am specifically concerned with is a battery connector. The question I have is to ensure that I am not over looking anything or causing long term reliability issues by reworking this section of the board three times. Here is the history. First time was normal SMT operation. Due to bad components we had to manually remove the connector and replace with new connectors. (Second time) The connectors that we manually reworked were still not the correct ones we wanted but allowed us to continue production. We had it in our mind that when the real ones come that we would rework the boards by removing the connector manually again and replacing it with the final version. (Third time) I am concerned about delaminating causing the connector to fall off easily with little or no force. (The test that I am performing is a destructive test and comparing the shear force to boards with just the original SMT process.) As a baseline Temperature cycling 100 degrees to -10 and then repeating the test above after visual inspection. What other testing would the group recommend to ensure that the reliability of the solder joint or pad leaching is not an issue? Are there any other reliability issues that I am not considering, and if so what are they, and is there any other testing or analysis that can be recommended to give me a better confidence rate. Thanks David Harman --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------