Hi Kathy The words you are looking for are in MIL-PRF-55110 A.6.4.1 Board thickness. The overall printed wiring board thickness includes metallic depositions, fusing, and solder mask. The overall thickness is measured across the printed wiring board extremities (thickest part), unless a critical area, such an edge card connector or card guide mounting location, is identified on the master drawing. This definition found in T-50 states that the thickness includes the laminate and metallization on the outer layers. Susan Mansilla Robisan Lab --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------