Hi Michel! If you send the picture directly to me, I can post it on my web page for all to see. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+------------------------------> | | "Arbour, Michel" | | | <[log in to unmask] | | ONTRON.COM> | | | Sent by: TechNet | | | <[log in to unmask]> | | | | | | | | | 06/08/2005 08:47 AM| | | Please respond to | | | TechNet E-Mail | | | Forum; Please | | | respond to "Arbour,| | | Michel" | | | | |---------+------------------------------> >--------------------------------------------------------------------------------------------------------------| | | | To: [log in to unmask] | | cc: | | Subject: [TN] Solderability issues with ENIG finish | >--------------------------------------------------------------------------------------------------------------| > Hi , > We've been having some solderability problems with one of our supplier. A > populated PCB was sent for elementary analysis and we got the results back > from the lab. > Before going further in the corrective action process i would like to know > if some of you agree and support the conclusions of the report based on > the following data. > > - The board sent to analysis was populated , one half of a smt pad did > not wet with solder the other half wetted properly > - The problem was noticeable on approx. 2% of the lot of PCB. 2-3 pads per > board > - The pad could not be soldered using an iron pen > - Solder paste is standard Sn63, Pb37 > > Two area on the pad were analyzed, one that was wetted , the other was > not. > Concentrations of element found were the following > - On the wetted area of the pad ALIAS : "AREA B" > 5.40% C > 2.04% N > 0.81% O > 45.32% Sn > 2.45% Ni > 3.67% Cu > 40.31% Pb > > On the unsolderable area of the pad ALIAS "AREA A" > 6.08% C > 9.08% P > 9.55% Sn > 66.62% Ni > 3.47% Cu > 5.20% Au > > The conclusion of the report states : > Area A is a fracture surface at the intermetallic boundary while Area B is > a fracture surface at or near the bulk solder. No mud cracking is seen at > Area A which indicates that black nickel was most likely not present. The > fact that there is a fairly large gold peak at area A indicates that there > may not have been sufficient time to adequately form the solder joint as > the gold may not have had time to diffuse into the bulk solder. > > I can post a picture of the pad if you can point me to a location > > > Michel Arbour > Kontron Canada Inc. > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------