Hi Alexandria, Is the July 27 meeting in San Jose or San Diego? The registration page says San Diego. Could you please confirm. Thank-you At 05:18 PM 6/22/2005 -0500, you wrote: >BGA and CSP Design and Assembly Process Implementation Using Lead Free Solder >July 25, 2005 - Portland, OR >July 27, 2005 - San Jose, CA > >Instructor: Vern Solberg > >Price: $495 IPC/Designers Council member > $695 Non-member > >To produce a RoHS compliant BGA and CSP assembly, the industry must >consider a number of new process variables. With the conversion to lead >free soldering, both components and circuit boards will be exposed to >higher temperatures at extended lengths of time. The Ball Grid Array and >Chip-Scale Package families of components, of course, are often seen by >many as the best solution to meet the space restrictions of newer >generations of electronic products. However, most of these devices are >packaged using organic materials that don't stand up to these higher >process temperatures. And, most of the organic substrate materials >traditionally used for fabricating the circuit board are not compatible >with the new levels of assembly. To address these issues, improvements e >in materials and processes for package assembly have been made. In >addition, the laminate manufacturers have a number of ways to manufacture >printed circuit boards that will remain physically stable when exposed to >the temperatures required for lead free assembly. > >This half-day workshop will cover both wide and fine pitch BGA packaging >methodology, packaging standards, qualification requirements land pattern >geometry alternatives and circuit routing guidelines. Important factors >related to specifying base materials and surface finishes compatible with >lead free soldering will also be discussed. > >To register for one of these workshops, please go to >http://www.ipc.org/calendar/2005/lfBGAimplement_0705/BGAcspLF_0705.htm. or >contact IPC's registration department at [log in to unmask] or call >847-597-2861. > >*****SPECIAL GROUP RATE: For a limited time only Register 3 people from >the same company at the same time for the same workshop date and receive >the fourth registration FREE! This offer ends June 30th. > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- Thank-you Mumtaz D/ 8165 - SMT Process Quality Bldg. V244H Voice (858)-882-1967 Fax (858)-882-3511 Page (858)-635-1180 email: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------